VERTICAL GRINDER

The Vertical Grinder is a high-precision processing system designed for surface grinding and dimensional preparation of silicon ingots prior to wafer slicing. It ensures precise ingot geometry, flatness, and parallelism to achieve high-quality wafer production. The system incorporates CNC/PLC-based control, automatic ingot positioning, and precision grinding technology to deliver excellent dimensional accuracy, superior surface finish, and consistent process repeatability. Its optimized grinding process minimizes silicon material loss, enhances wafer yield, and supports high-throughput, automated ingot-to-wafer manufacturing with reliable and low-maintenance operation.

• Overall production capacity +17%
• 17% Floor space -23%
• 23% Silicon consumption -9%
• 9% Automatic ingot positioning and dressing: saves time and effort while improving quality
• Cost reduction and efficiency enhancement