HALF CUTTER AND GRINDER (HCG)

The Half Cutter and Grinder is a high-precision processing system designed for cutting silicon ingots into required sections and precision grinding prior to wafer slicing in the ingot-to-wafer manufacturing process. The integrated cutting and grinding operations ensure accurate ingot dimensions, excellent flatness, and superior surface quality while minimizing silicon loss and edge damage. Equipped with PLC/CNC-based control, automatic material handling, and intelligent process monitoring, the system delivers high machining accuracy, consistent repeatability, and high throughput. Its automated operation and quick recipe changeover improve production efficiency, maximize wafer yield, and ensure reliable performance in high-volume photovoltaic manufacturing.