Evaporation System

Features

• Multi-source co-deposition for large-area coating
• Precise thermal field and temperature control

Technical Parameters

• Film Thickness Non-uniformity : ≤5% (within wafer, wafer-to-wafer, batch-to-batch)
• Deposition Speed Stability : ≤±0.5%
• Temperature Control Precision : ±1%
• Temperature Fluctuation : ±2 °C
• Width : 600 mm