Recropper

The recropper is a high-precision cutting system designed for wafer sampling and the recropping of silicon ingots and bricks. It utilizes advanced diamond wire cutting technology to produce flat, smooth, and damage-free cutting surfaces with minimal kerf loss, low edge chipping, and reduced micro-crack formation. The system features a rigid mechanical structure and PLC-based automatic control with a touchscreen HMI, ensuring high cutting accuracy, excellent repeatability, and stable operation. Suitable for both R&D and production environments, it delivers reliable, efficient, and low-maintenance performance for silicon material preparation and quality control.