MULTI-WIRE SAW
The Multi-Wire Saw is a high-precision wafer slicing system designed for the conversion of silicon ingots into thin photovoltaic wafers. It employs high-speed diamond wire cutting technology to achieve excellent wafer thickness uniformity, low Total Thickness Variation (TTV), and minimal kerf loss, maximizing silicon utilization. The system incorporates precise wire tension control, automatic wire management, and PLC/CNC-based process control to ensure stable cutting performance, reduced edge chipping and micro-cracks, and superior surface quality. With fully automated loading and unloading capabilities, it delivers high throughput, consistent wafer quality, and reliable operation for large-scale ingot-to-wafer manufacturing.
- Super roller distance: 290/390 mm
- Automated Gantry/AGV loading and unloading
- Wire speed: 2400 m/min
- Tension fluctuation: ±0.2 N
- Overall machine noise: ≤80 dB
