MULTI-WIRE SAW

Our Multi-Wire Saw is engineered to deliver high-precision, high-efficiency wafer slicing for advanced semiconductor and photovoltaic Designed with cutting-edge technology and intelligent automation, the system provides exceptional cutting accuracy, stable operation, and increased productivity while minimizing material loss and operating costs.

The machine features a super roller distance of 290 mm or 390 mm, providing excellent flexibility for processing various ingot sizes and meeting diverse production requirements. Integrated automated Gantry or AGV loading and unloading systems enable seamless material handling, reducing manual intervention and supporting fully automated production lines.

With a maximum wire speed of 2,400 m/min, the Multi-Wire Saw achieves high cutting efficiency while maintaining excellent surface quality and dimensional accuracy. Advanced motion control and precision engineering ensure smooth operation, enabling manufacturers to maximize throughput without compromising product quality.

The system maintains exceptional cutting stability with tension fluctuation controlled within ±2 N, ensuring consistent wire performance and minimizing the risk of wire breakage. This precise tension control contributes to improved wafer quality, higher production yield, and enhanced process reliability.

Designed for a comfortable and efficient manufacturing environment, the machine operates with an overall noise level of 80 dB or lower, reducing workplace noise while maintaining high-performance operation. Combining intelligent automation, precision control, high-speed cutting, and reliable performance, the Multi-Wire Saw provides an advanced and dependable solution for modern wafer manufacturing.